Broadcom, known for its networking and telecommunications prowess, is making waves in the custom chip design industry. Recently showcasing a groundbreaking XPU chip at investor events, designed for a “large consumer AI company,” Broadcom is flexing its technological muscle in the realm of processor innovation.
Referred to as XPUs to maintain secrecy regarding their specific applications, these chips feature high-bandwidth memory, hinting at their potential use in artificial intelligence or advanced network switching tasks. The impressive design includes multiple compute units, extensive HBM modules, high-speed inter-chip connectivity, and top-tier networking capabilities, promising exceptional performance in demanding applications.
The achievement of creating such large-scale chiplets near the reticle size is remarkable, showcasing Broadcom’s engineering expertise. Assisted by likely partner TSMC, Broadcom has not only developed this cutting-edge chip but has also attained high yields, a critical success factor in chip manufacturing.
HEALTH
WORLD AFFAIRS
TECHNOLOGY
CREATIVE
