Qualcomm unveils AI and connectivity chips at Mobile World Congress

Key Points:

  • Qualcomm unveiled a suite of AI, 5G, and Wi-Fi devices at Mobile World Congress in Barcelona.
  • Qualcomm’s AI Hub features over 75 pre-optimized AI models for seamless deployment on devices.
  • The Snapdragon X80 5G Modem-RF System integrates advanced capabilities, including NB-NTN satellite communications support, and the Fast Connect delivers AI-optimized performance in mobile connectivity.


Qualcomm made a splash at the Mobile World Congress (MWC) in Barcelona by unveiling a suite of cutting-edge AI, 5G, and Wi-Fi devices. These innovations, including the Snapdragon 8 Gen 3 and Snapdragon X Elite, aim to revolutionize intelligent computing and enhance various industries and consumer experiences.


At the event, Qualcomm emphasized the importance of on-device AI in conjunction with cloud technology to provide greater personalization, privacy, reliability, and efficiency. The company showcased a new library of over 75 pre-optimized AI models called the Qualcomm AI Hub, designed for seamless deployment on Snapdragon and Qualcomm platforms. This initiative allows developers to integrate AI models into their applications, enabling immediate responses, reliability, privacy, personalization, and cost savings.


Qualcomm’s efforts in on-device AI are coming to fruition with the commercial availability of devices from major brands like Samsung Galaxy, Xiaomi, and OPPO. These devices leverage the power of Qualcomm’s AI and connectivity chips to enhance user experiences across various categories such as smartphones, next-gen PCs, XR devices, vehicles, and robotics.


The Qualcomm AI Hub provides developers with a central location to access AI resources, including a library of optimized models, to create innovative applications on Snapdragon platforms. These optimized models result in up to four times faster inferencing performance, allowing developers to leverage on-device AI capabilities effectively.


Noteworthy announcements at MWC include the introduction of the Snapdragon X80 5G Modem-RF System, touted as the world’s most advanced 5G platform, integrating 5G-Advanced capabilities and supporting connectivity to non-terrestrial networks. Qualcomm also showcased the Fast Connect 7900 mobile connectivity system, the first to merge Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip, offering AI-optimized performance and power efficiency.


In the automotive sector, Qualcomm is leveraging its AI solutions to enhance driver and passenger experiences through the Snapdragon Digital Chassis Platform. Additionally, the company is demonstrating innovative AI capabilities for consumer IoT devices, such as Humane’s AI Pin, which operates on a Snapdragon platform and provides users with conversational AI in a screenless format.


Qualcomm’s emphasis on AI and connectivity chips underscores its commitment to driving technological advancements and enhancing user interactions across various devices and industries. The company’s vision for a future powered by intelligent computing is poised to reshape how we engage with technology, paving the way for a more personalized, efficient, and connected world.



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